Click:我的Femboy室友最新版本APK

IRFH8318TRPBFs Benefits:

-Enable better thermal dissipation
-Increased Power Density
-Multi-Vendor Compatibility
-Easier Manufacturing
-Environmentally Friendlier
-Increased Reliability

CODE

DESCRIPTION

Ao

Dimension design to accommodate the component width

Bo

Dimension design to accommodate the component lenght

Ko

Dimension design to accommodate the component thickness

W

Overall width of the carrier tape

P1

Pitch between successive cavity centers

Product Features

Type

Main product features

IRFH8318TRPBF

Low Thermal Resistance to PCB (< 1.7°C/w)

Low Profile (<1.2mm)

Industry-Standard Pinout

Compatible with Existing Surface Mount Techniques

IRFH8318TRPBF Infineon Electronic Components Applications

Synchronous MOSFET for high frequency buck converters